Control of Manufacturing Processes
Readings
SES # |
TOPICS |
READINGS |
1 |
Introduction — processes and variation framework |
Process control overview (PDF) Boning, Duane S., et al. "A General Semiconductor Process Modeling Framework." IEEE Transactions on Semiconductor Manufacturing 5 (November 1992): 266-280. |
5 |
Probability models, parameter estimation, and sampling |
Kurtosis handout (PDF) |
10 |
Yield modeling |
Ciplickas, Dennis J., et al. "Predictive Yield Modeling of VLSIC's." IEEE 5th International Workshop on Statistical Metrology (June 2000): 28-37. Stapper, Charles H., and Raymond J. Rosner. "Integrated Circuit Yield Management and Yield Analysis: Development and Implementation." IEEE Transactions on Semiconductor Manufacturing 8 (May 1995): 95-102. |
17 |
Nested variance components |
Drain, Davis. "Variance Components and Process Sampling Design." Chapter 3 in Statistical Methods for Industrial Process Control. New York, NY: Chapman & Hall, 1996. ISBN: 9780412085116. Example, nested variance components (XLS) |
19 |
Case study 1: tungsten CVD DOE/RSM |
Example, tungsten RSM (XLS) Example, tungsten RSM (JMP) |
20 |
Case study 2: cycle to cycle control |
Hardt, D. E., and Tsz-Sin Siu. "Cycle to Cycle Manufacturing Process Control." SMA, 2002. Rzepniewski, Adam K., et al. "Cycle-to-Cycle Control of Multivariable Manufacturing Processes with Process Model Uncertainty." ASME International Mechanical Engineering Congress and Exposition (2004): IMECE2004-61783. |
21 |
Case study 3: spatial modeling |
Guo, Ruey-Shan, and Emanuel Sachs. "Modeling, Optimization, and Control of Spatial Uniformity in Manufacturing Processes." IEEE Transactions on Semiconductor Manufacturing6 (February 1993): 41-57. Davis, Joseph C., et al. "A Robust Metric for Measuring Within-Wafer Uniformity." IEEE Transactions on Components, Packaging, and Manufacturing Technology C 19 (October 1996): 283-289. Mozumder, Purnendu K., and Lee M. Loewenstein. "Method for Semiconductor Process Optimization Using Functional Representations of Spatial Variations and Selectivity." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15 (June 1992): 311-316. |
Assignments
Some solutions are taken from student submissions for each assignment, and are used courtesy each student named below, with their permission.
This page contains problem sets for the course, files containing data used in the problems, and solutions for most problems.
ASSIGNMENTS |
PROBLEMS |
DATA |
SOLUTIONS |
1 |
(PDF) |
|
(PDF) (Courtesy of Eehern Wong.) |
2 |
(PDF) |
Problem 4:(XLS) |
(PDF) |
3 |
(PDF) |
Problem 4: (XLS) Problem 5: (XLS) |
(PDF) |
4 |
(PDF) |
Problem 2: (XLS) |
(PDF) |
5 |
(PDF) |
|
(PDF) |
6 |
(PDF) |
Problem 1: (XLS) |
(PDF) (Courtesy of Xiangyong Su, Koji Umeda, and Kaizhao Lee.) |
7 |
(PDF) |
Problem 3: (XLS) |
(PDF) (Courtesy of Xiangyong Su and Richard Schwenke.) |
8 |
(PDF) |
Problem 1: (XLS) |
(PDF) (Courtesy of Mohammed Imani Nejad and Xiao Shen.) |
Exams
This page contains exams for the course, as well as some study materials and archived exams and solutions.
YEAR |
QUIZ 1 |
QUIZ 2 |
2005 |
Problems (PDF) |
|
2006 |
Problems (PDF) Solutions (PDF) |
Problems (PDF) Solutions (PDF) |
2007 |
Problems (PDF) Solutions (PDF) |
Problems (PDF) |
2008 |
Problems (PDF) Solutions (PDF) |
Problems (PDF) Solutions (PDF) |
Study Materials
Degrees of freedom handout (PDF)
Example, 2^2 with centerpoints (XLS)
Example, Drain Chapter 3, problem 4 (XLS)
Quiz 2 study guide (PDF)
Quiz 2 review session (PDF)